MOSFET器件和工艺技术，包括UBM / BGBM / WLCSP-组装

Strength

• MOSFET Device and Process Technology including UBM / BGBM / WLCSP-Assembly

• Device / Process SimulationCapability (2D/3D simulation)

• Design Capability (Mask CAD, PCB CAD, Mechanical CAD)

• Owned Evaluation Lab in Japan: Component and Circuit Analysis/MeasurementCapability

• Utilizing more than 20 years of device experience and sales network in Asia

Low Voltage Power Mosfet (WLCSP)

• Development of high-performance devices and solution proposal with best-in-class technology

• Propose Power MOSFET solutions in terms of cost, robust quality, performance, and service

• Provide high-performance products with advanced wafer process and package development technology

• Move to middle voltage after low voltage 12/24V launch

优势

• MOSFET器件和工艺技术，包括UBM / BGBM / WLCSP-组装；

• 具备器件/工艺仿真能力（2D/3D仿真）；

• 具备设计能力（包含CAD、PCB CAD、机械CAD）；

• 在日本拥有评估实验室：具备元件和电路分析/测量能力；

• 超过20年的器件经验和亚洲的销售网络。

低压 Mosfet（WLCSP）

• 以一流的技术，开发高性能器件，并且同时能够提出相应的解决方案和建议；

• 在成本、质量稳定、性能和服务方面提出功率MOSFET的解决方案；

• 采用先进的晶圆制程和封装技术，提供高性能产品；

• 在推出低电压12/24V后转向中电压。