在日本拥有评估实验室：具备元件和电路分析/测量能力

Strength• MOSFET Device and Process Technology including UBM / BGBM / WLCSP-Assembly• Device / Process SimulationCapability (2D/3D simulation)• Design Capability (Mask CAD, PCB CAD, Mechanical CAD)• Owned Evaluation Lab in Japan: Component and Ci.

MOSFET器件和工艺技术，包括UBM / BGBM / WLCSP-组装

Strength• MOSFET Device and Process Technology including UBM / BGBM / WLCSP-Assembly• Device / Process SimulationCapability (2D/3D simulation)• Design Capability (Mask CAD, PCB CAD, Mechanical CAD)• Owned Evaluation Lab in Japan: Component and Ci.

Executive Summary

Strength• MOSFET Device and Process Technology including UBM / BGBM / WLCSP-Assembly• Device / Process SimulationCapability (2D/3D simulation)• Design Capability (Mask CAD, PCB CAD, Mechanical CAD)• Owned Evaluation Lab in Japan: Component and Ci.

Executive Summary

Strength• MOSFET Device and Process Technology including UBM / BGBM / WLCSP-Assembly• Device / Process SimulationCapability (2D/3D simulation)• Design Capability (Mask CAD, PCB CAD, Mechanical CAD)• Owned Evaluation Lab in Japan: Component and Ci.

Executive Summary

Strength• MOSFET Device and Process Technology including UBM / BGBM / WLCSP-Assembly• Device / Process SimulationCapability (2D/3D simulation)• Design Capability (Mask CAD, PCB CAD, Mechanical CAD)• Owned Evaluation Lab in Japan: Component and Ci.

Reference Schematic

Reference Schematic